G808P-A3

Beiliande G808P-A3 has a high-performance two-way universal server, with the help of Intel ® The latest generation Xeon Ice Lake series processor adopts the latest 10nm manufacturing process. Its unique large capacity and high scalability design can significantly improve processing throughput and reliability at low cost. It uses efficient RAID array cards, supports multiple disk redundancy technologies, and has the functions of automatic reconstruction and dynamic sector repair, online capacity expansion, RAID level migration, etc; It provides an extremely flexible platform in terms of performance, scalability and built-in functions.

Excellent performance, super computing power

Supports Intel® 4th/5th Xeon® Scalable processors, single processor supports up to TDP 350W

The new UPI2.0 interconnection architecture, each transmission channel can reach 16GT/s, and the computing performance is strong

Supports up to 32 DDR5 memories, maximum frequency 5600MHz, memory bandwidth increased by 75%

Full support for PCIe 5.0 protocol, transmission rate increased by 100%
Flexible configuration and extreme expansion

Supports a variety of hard disk configuration solutions, allowing you to choose independently to meet massive storage needs

Onboard integrated network card, flexible network card expansion, and network configuration on demand

Rich PCIe resources, easy to expand, to meet the application of different scenarios
Green, energy-saving, economical and silent

Efficient heat dissipation design, supports CPU intelligent frequency adjustment, fan PID intelligent speed adjustment, and dynamic output of power consumption

Provides 80 PLUS Platinum/Titanium power modules with different energy efficiency levels, high efficiency and energy saving

Optional cold plate liquid cooling greatly reduces noise and data center PUE

technical specifications

G808P-A3

Model

Form factor

Processor

Chipset

Memory

Storage controller

Storage

Network

PCIe expansion

I/O ports

Management

Security

Fan

Power supply

Operating system

Size

Environment

G808P-A3
4U Rackmount
Dual 4th/5th Gen Intel Xeon Scalable Processor(Air/Liquid cooled) 350W TDP
Intel® C741 Chipset
32x DDR5 RDIMM slots,5600MHz,Up to 16TB
DIMM Sizes 16GB, 32GB, 64GB, 128GB, 256GB, 512GB
Supports HBA/RAID cards JBOD,RAID 0, 1, 10, 5, 6, 50, 60
When configuring RAID controllers, they can support Cache supercapacitor protection, provide RAID level migration, disk roaming, self-diagnostics, Web remote setup, etc, and support RAID card secure boot up.
Front:
8x 2.5"/3.5" SAS/SATA/NVMe hot-swap hard drive
Internal:
2x M.2 2280/22110 SATA/PCIe 3.0 x4
Optional1: 2x 1GbE BaseT LAN
Optional2: 2x 10GbE BaseT LAN
Optional various types of network adapters based on standard PCIe slots
UP to 13x PCIe 5.0 expansion slots
Up to 8x FHFL, double-width GPU
2xUSB 3.0, 1xVGA, 1xCOM
1x 1GbE RJ45 dedicated IPMI LAN
Onboard management chip, independent interface, support SNMP, IPMI, provide GUI, virtual KVM, virtual media, SOL, intelligent power supply, remote control, hardware monitoring and other features
Optional TPM security management module, lid intrusion detection
Hot-swap fan modules support N+1 redundancy
Support 2+2 redundancy
2600W/3000W titanium Level power supplies
Microsoft Windows Server,Red Hat Enterprise Linux,SUSE Linux Enterprise Server,CentOS,VMware ESXi,Citrix XenServer,Ubuntu Linux
Please consult sales staff for specific versions.
440mm x 174.5mm x 800mm （W*H*D）
Operating Temperature: 10°C to 35°C(50°F to 95°F), Operating Relative Humidity: 8% to 90% (non-condensing)