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G706P-S2
  • Beiliande G706P-S2 has a high-performance two-way universal server, with the help of Intel ® The latest generation Xeon Ice Lake series processor adopts the latest 10nm manufacturing process. Its unique large capacity and high scalability design can significantly improve processing throughput and reliability at low cost. It uses efficient RAID array cards, supports multiple disk redundancy technologies, and has the functions of automatic reconstruction and dynamic sector repair, online capacity expansion, RAID level migration, etc; It provides an extremely flexible platform in terms of performance, scalability and built-in functions.
  • Excellent performance, super computing power
    Supports Intel® 3rd Xeon® Scalable processor, single processor supports maximum TDP 270W

    The new UPI2.0 interconnection architecture, each transmission channel can reach 16GT/s, and the computing performance is strong

    Supports up to 16 DDR4 memories, maximum frequency 4800MHz, memory bandwidth increased by 75%

    Full support for PCIe 4.0 protocol, transmission rate increased by 100%
  • Flexible configuration and extreme expansion
    Supports a variety of hard disk configuration solutions, allowing you to choose independently to meet massive storage needs

    Onboard integrated network card, flexible network card expansion, and network configuration on demand

    Rich PCIe resources, easy to expand, to meet the application of different scenarios
  • Green, energy-saving, economical and silent
    Efficient heat dissipation design, supports CPU intelligent frequency adjustment, fan PID intelligent speed adjustment, and dynamic output of power consumption

    Provides 80 PLUS Platinum/Titanium power modules with different energy efficiency levels, high efficiency and energy saving

    Optional cold plate liquid cooling greatly reduces noise and data center PUE
technical specifications
G706P-S2
  • Model
  • Form factor
  • Processor
  • Chipset
  • Memory
  • Storage controller
  • Storage
  • Network
  • PCIe expansion
  • I/O ports
  • Management
  • Security
  • Fan
  • Power supply
  • Operating system
  • Size
  • Environment

  • G706P-S2
  • 2U Rackmount
  • Dual 3rd Gen Intel  Xeon  Scalable Processor 270W TDP
  • Intel® C621A Chipset
  • 16x DDR4 RDIMM slots,3200MHz,Up to 4TB
    Supports Intel Optane Persistent 200 series memory
    DIMM Sizes 16GB, 32GB, 64GB, 128GB, 256GB
  • Supports HBA/RAID cards JBOD,RAID 0, 1, 10, 5, 6, 50, 60
    When configuring RAID controllers, they can support Cache supercapacitor protection, provide RAID level migration, disk roaming, self-diagnostics, Web remote setup, etc, and support RAID card secure boot up.
  • Front:
    6x 2.5" SAS/SATA hot-swap hard drive + 4x 2.5" NVMe hot-swap hard drive
  • Optional OCP slot
    Optional various types of network adapters based on standard PCIe slots
  • UP to 8x PCIe 4.0 expansion slots
    Up to 6x FHFL, double-width GPU or 8x FHFL, single-width GPU
  • Rear: 1xVGA, 2xUSB 3.0
  • 1x 1GbE RJ45 dedicated IPMI LAN
    Onboard  management chip, independent interface, support SNMP, IPMI, provide GUI, virtual KVM, virtual media, SOL, intelligent power supply, remote control, hardware monitoring and other features
  • Optional TPM security management module, lid intrusion detection
  • Hot-swap fan modules support N+1 redundancy
  • Support 1+1 redundancy
    2600W titanium Level power supplies
  • Microsoft Windows Server,Red Hat Enterprise Linux,SUSE Linux Enterprise Server,CentOS,VMware ESXi,Citrix XenServer,Ubuntu Linux
    Please consult sales staff for specific versions.
  • 440mm x 88mm x 767mm （W*H*D）
  • Operating Temperature:  10°C to 35°C(50°F to 95°F), Operating Relative Humidity: 8% to 90% (non-condensing)
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